Mobile-Menu

Thermal Management Parker Chomerics Introduces Reusable Thermal Gap Pad

Quelle: Pressemitteilung 1 min Lesedauer

Anbieter zum Thema

Chomerics Europe Parker Hannifin Ltd. Seal Group
FAULHABER Antriebssysteme
Caltest Instruments GmbH

The new Therm-A-Gap Pad 30RB offers a thermal conductivity of 3.0 W/mK while maintaining its performance after repeated compression. The material is designed for electronics requiring multiple assembly cycles.

Thermal Management: Parker Chomerics' Therm-A-Gap Pad 30RB provides thermal conductivity of 3.0 W/mK and maintains its performance after repeated compression cycles.(Bild: (c)Viktor Lugovskoy)
Thermal Management: Parker Chomerics' Therm-A-Gap Pad 30RB provides thermal conductivity of 3.0 W/mK and maintains its performance after repeated compression cycles.
(Bild: (c)Viktor Lugovskoy)

Parker Chomerics has introduced Therm-A-Gap Pad 30RB, a thermally conductive gap filler designed for applications requiring repeated assembly and disassembly. According to the manufacturer, the material can withstand multiple compression cycles with minimal loss of thickness while maintaining its original thermal performance.

With a thermal conductivity of 3.0 W/mK, the pad is intended to transfer heat between electronic components and cooling surfaces. Its elasticity and recovery properties help accommodate large stack-up tolerances while reducing mechanical stress on sensitive components. The material also provides vibration and shock damping and requires relatively low compression force.

Designed for Repeated Compression

Unlike thermal interface materials that may need replacement after disassembly, Therm-A-Gap Pad 30RB is designed for reuse. This makes it suitable for applications involving repeated testing, maintenance, or rework.

Potential applications include chipset testing, automotive electronic control units (ECUs), telecommunications equipment, consumer electronics, and computing systems such as desktops, laptops, and servers. The material is naturally tacky on both sides, helping it remain in position during assembly. A non-tacky version is also available for applications with different handling requirements.

Material Properties and Available Formats

Parker Chomerics specifies a thermal impedance of 2.9°C·cm²/W and a volume resistivity of 10¹³ Ω·cm. The RoHS-compliant material is designed for operating temperatures from -55°C to 200°C.

Therm-A-Gap Pad 30RB is available in thicknesses ranging from 0.51 to 5.08 mm, in increments of 0.254 mm. Standard sheets measure 228.6 mm × 228.6 mm. Carrier options include aluminum foil and thermally optimized Kapton polyimide film. Pressure-sensitive adhesive versions are available with the aluminum foil carrier. Parker Chomerics also offers custom dimensions and die-cut parts, supplied individually or in sheets.

Parker Chomerics will be exhibiting at electronica 2026 in Munich, November 10–13, in Hall B3, Booth 457. (sb)

(ID:51000568)

Jetzt Newsletter abonnieren

Verpassen Sie nicht unsere besten Inhalte

Mit Klick auf „Newsletter abonnieren“ erkläre ich mich mit der Verarbeitung und Nutzung meiner Daten gemäß Einwilligungserklärung (bitte aufklappen für Details) einverstanden und akzeptiere die Nutzungsbedingungen. Weitere Informationen finde ich in unserer Datenschutzerklärung. Die Einwilligungserklärung bezieht sich u. a. auf die Zusendung von redaktionellen Newslettern per E-Mail und auf den Datenabgleich zu Marketingzwecken mit ausgewählten Werbepartnern (z. B. LinkedIn, Google, Meta).

Aufklappen für Details zu Ihrer Einwilligung

Weiterführende Inhalte