As automotive ECUs become more compact, highly integrated, and increasingly powerful, MLCCs are exposed to greater mechanical and thermal stress. This increases the risk of cracking and reliability concerns in applications such as ADAS, powertrain, safety, and body electronics. This paper explains how soft-termination MLCC technology helps mitigate these challenges by absorbing board flexure and thermal stress. It also introduces a new low-silver filler designed to support high reliability, improved material supply stability, and reduced exposure to raw material price fluctuations. The paper also outlines the benefits of products qualified to Volkswagen's VW 80808 reliability standard.

In our free whitepaper you learn more about:

• Why soft-termination MLCCs are gaining adoption in automotive ECUs
• Four factors driving the shift to soft-termination technology
• How low-silver filler technology supports cost stability and supply continuity
• Reliability for board flexure, thermal cycling, and ion migration resistance
• VW 80808-qualified product portfolio and future roadmap