Electrical Connectors Forum Single-Pair Ethernet and New Connection Technology

Von Kristin Rinortner 3 min Lesedauer

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The Electrical Connectors Forum at this year’s electronica on November 11, 2026, starting at 1:00 p.m., will cover a wide range of topics, from the standardization of industrial communication interfaces to efficient wiring and reliable printed circuit board connections, all the way to the digital validation of device designs.

Electronica Stage in Hall A5: The Electrical Connectors Forum will cover a wide range of topics.(Bild:  Phoenix Contact_G_Roman_Shutterstock [M])
Electronica Stage in Hall A5: The Electrical Connectors Forum will cover a wide range of topics.
(Bild: Phoenix Contact_G_Roman_Shutterstock [M])

Connectors are far more than just mechanical interfaces: They determine the performance, reliability, and future-proofing of electronic devices and industrial networks. The Electrical Connectors Forum at electronica 2026 is therefore dedicated to current developments in connection technology—from Single Pair Ethernet (SPE) and standardized connector interfaces to innovative connection technologies and simulation tools for device development.

A special focus is on Single Pair Ethernet. This Ethernet technology transmits data over a single wire pair, thereby enabling end-to-end communication from the sensor all the way to the cloud. Interoperable interfaces and standardized connector faces are prerequisites for its widespread adoption. On November 11, three presentations will shed light on different aspects of this development.

Single Pair Ethernet

The event kicks off with a presentation by Torben Schöneberg titled “Single Pair Ethernet: The Hardware for the Industrial Ethernet of the Future—A Standardized SPE Connector Interface in Accordance with IEC 63171-7.” The presentation focuses on the new connector interface and its significance for a vendor-neutral infrastructure. In his presentation “One SPE Does Not Fit All: The Right SPE Interface for Every Application,” Kurt Robert Hippler compares different market requirements, standards, and application scenarios. In their presentation “Single Pair Ethernet for Seamless Industrial Connectivity,” Verena Neuhaus and Tim Kindermann demonstrate how the new interface is intended to improve interoperability and pave the way for end-to-end Ethernet communication.

Andreas Huhmann addresses how the requirements for industrial automation devices are changing in his presentation “New Spirit / New Guideline: What Connectivity Do Industrial Automation Devices Need?” As head of a working group within the PROFIBUS User Organization (PNO), he focuses in particular on hybrid interfaces and their significance for industrial connectivity—including SPE.

Connection Technology

In addition to data transmission, the focus is on connection technology. Meikel Reilender presents SNAP-IN device connection technology as an enabler of modular device platforms. Application examples range from I/O systems to EMC applications and DC applications. Matthias Stöver and Lucas Lässig demonstrate with Push-X how tool-free connection technology can improve assembly processes, quality, and ergonomics. The focus is not only on wiring but also on testing, maintenance, and rework processes, as well as the prerequisites for greater automation.

The selection of PCB connectors also influences the reliability and performance of electronic devices. Using practical examples, Thomas Schulze explains which mechanical, electrical, and layout-related criteria are crucial for board-to-board connections. These include, among other things, height, tolerance compensation, vibration resistance, current-carrying capacity, EMC shielding, and the transmission of high-frequency data.

Thermal Simulation

Martin Kirchhoff offers further insight into digital development processes with his presentation “Optimal Electronics Design Through Thermal Simulation for Device Developers.” He demonstrates how device developers can simulate the thermal behavior of custom electronic enclosures as early as the initial design phase.

The process begins with an online enclosure configurator, which is used to define the geometry, installation conditions, ambient temperature, and power dissipation. Based on this information, a customized thermal simulation is generated and provided as a 3D PDF.

The forum will take place on November 11, 2026, from 1:00 p.m. to 5:30 p.m. on the electronica Stage in Hall A5. Admission is included with your trade show ticket.(kr)

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