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Solver Enhancements enable Thermal Simulation for Electronics

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ALPHA-Numerics GmbH

Creating thermal models by using intelligent objects

Gerber support: Making it easy to capture information on PCB traces, enabling modelling in detail instead of approximating the copper content on each layer.(Image: Future Facilities)
Gerber support: Making it easy to capture information on PCB traces, enabling modelling in detail instead of approximating the copper content on each layer.
(Image: Future Facilities)

User interface changes in 6SigmaET make it easier to create a thermal model using intelligent objects, PCB and CAD data. Import functions in Release 9 make it possible to use the output of EDA tools using the IDF, IDX, XFL and Gerber file formats. Support for Gerber, for example, makes it a lot easier to capture information on PCB traces so that they can be modelled in detail instead of approximating the copper content on each layer.

Some thermal simulation environments demand that commonly used and thermally important components (such as heat sinks) be modelled as a complex collection of cuboid objects, ones that often needs to be generated by hand. 6SigmaET can use intelligent objects to represent these components in a way that is much faster and easier to use.

Intelligent objects can include power supplies, components such as resistors, heat sinks and thermal interface materials. The thermal behaviour of these objects can be configured parametrically using property sheets to match their specification, thereby ensuring that the thermal characteristics of each object are taken into account fully during simulation.

A new object panel in the tool displays all of the intelligent modelling objects that are available, and allows them to be dragged and dropped into the model. Powerful search functions make it easier to select the appropriate object to model a given component or subsystem.

For Release 9, 6SigmaET adopts a modern ribbon-based user interface that replaces the traditional menus and toolbars of older-generation products. Context-sensitive ribbons, which are familiar to users of Microsoft Office, highlight the key actions available for each task and enable the user to quickly find the commands needed to create and analyse a model. Once each simulation has been completed, a model can be exported so that any proposed modifications can be shared easily with other engineers.

The improvements to the grid and solver algorithms, as well as modelling enhancements focused on ease of use, make what used to be impossible-to-solve cases in traditional thermal modelling tools now not only possible in 6SigmaET, but also highly practical. Thermal simulation is ready to provide engineers with the tools to deal effectively with the heat generated by products and systems that they are developing. //FG

* * Tom Gregory is the 6SigmaET Product Specialist at Future Facilities (www.6sigmaET.info).

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