congatec GmbH

he focus of our presentation at Embedded World (Hall 5, Booth 135) was the company’s extensive COM-HPC ecosystem, comprising modules in all form factors as well as cooling solutions and application examples. Featuring Intel Xeon D processors, our broad range of COM-HPC Server modules in Size E and Size D target industrial edge servers and rugged 5G network equipment. They are ideal to accelerate the next generation of real-time microserver workloads in industrial applications and rugged outdoor environments. Equipped with 12th Generation Intel Core processors, congatec’s COM-HPC Size A and Size C as well as COM Express Type 6 modules provide a quantum leap in multitasking performance and scalability to accelerate multithreaded applications and to execute dedicated real-time tasks more efficiently. Visitors to the congatec booth could also experience real-life AI edge applications with dedicated AI accelerators and even a system design that integrates the new COM-HPC Client and Server modules and is the result of congatec’s collaboration with Christmann and the University of Bielefeld. Ultimately, this system also serves as a reference design for application-specific system designs that congatec offers together with other strategic partners.